In several stages the semiconductor manufacturing plant was expanded to the first European mega-fab with a manufacturing capacity of 80.000 wafers per month.
About 3.000 employees are working today in Dresden.
Module One Annex
Year of construction 2010 – 2011
Construction volume: GFA about 59.000 m²/ GCV about 460.000 m³
Fab 36 – Module One
Year of construction 2004 – 2005
Construction volume: GFA about 87.000 m² / GCV about 800.000 m³
Bump & Test Facility (BTF)
Year of construction 2006